Brief: Discover the Metal Bond Diamond Grinding Wheel, designed for precision edge grinding on silicon and sapphire wafers. This wheel offers uniform sharpness, exceptional abrasion resistance, and is available in various grit sizes and models for both dry and wet grinding. Enhance your production output with our durable and low-maintenance solution.
Related Product Features:
Designed for edge grinding on silicon and sapphire wafers with uniform sharpness.
Available in metal bond and resin bond for versatile applications.
Offers precision accuracy in wheel shape and exceptional abrasion resistance.
Suitable for both outer-circumference and notch machining.
Comes in single-groove, multi-groove, and composite rough finishing types.
Low maintenance requirements and increased production output.
Superior heat transfer from ground material for extended product life.
Customizable in diameter, arbor hole, grit size, and model.
সাধারণ জিজ্ঞাস্য:
What types of grinding methods are supported by this wheel?
The Metal Bond Diamond Grinding Wheel supports both dry and wet grinding methods.
What are the available grit sizes for this grinding wheel?
Grit sizes range from 80# to 800#, with options for customization to meet specific needs.
Can the wheel be customized for specific requirements?
Yes, the wheel can be customized in diameter, arbor hole size, grit size, and model to suit various applications.